US 11,876,030 B2
Clad material and method for producing same
Tomotsugu Aoyama, Tokyo (JP); Hiroto Narieda, Tokyo (JP); Ilho Kim, Gyeonggi-do (KR); and Meoung whan Cho, Gyeonggi-do (KR)
Assigned to DOWA HOLDINGS CO., LTD., Tokyo (JP); and THE GOODSYSTEM CORPORATION, Gyeonggi-do (KR)
Appl. No. 16/771,730
Filed by Dowa Holdings Co., Ltd., Tokyo (JP); and The Goodsystem Corporation, Gyeonggi-do (KR)
PCT Filed Dec. 3, 2018, PCT No. PCT/JP2018/044388
§ 371(c)(1), (2) Date Jun. 11, 2020,
PCT Pub. No. WO2019/116946, PCT Pub. Date Jun. 20, 2019.
Claims priority of application No. 2017-237100 (JP), filed on Dec. 11, 2017.
Prior Publication US 2021/0175147 A1, Jun. 10, 2021
Int. Cl. C22C 27/04 (2006.01); B32B 5/16 (2006.01); B32B 15/16 (2006.01); B32B 15/20 (2006.01); H01L 23/373 (2006.01); C22C 9/00 (2006.01); C23C 18/38 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3735 (2013.01) [B32B 5/16 (2013.01); B32B 15/16 (2013.01); B32B 15/20 (2013.01); C22C 9/00 (2013.01); C22C 27/04 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2264/108 (2013.01); B32B 2264/403 (2020.08); C23C 18/38 (2013.01); H01L 21/4882 (2013.01); H01L 23/562 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for producing a clad material, the method comprising the steps of:
preparing a Cu-graphite layer by sintering a graphite powder having a Cu film on the surface thereof;
preparing Mo—Cu layers, each of which has a metal film of a single metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof;
arranging each of the Mo—Cu layers on a corresponding one of both sides of the Cu-graphite layer so as to allow the metal film of a corresponding one of the Mo—Cu layers to contact the corresponding one of both sides of the Cu-graphite layer; and
heating the Cu-graphite layer and the Mo—Cu layers while a pressure is applied between the Cu-graphite layer and the Mo—Cu layers,
wherein the metal film is intermittently arranged between the corresponding one of both sides of the Cu-graphite layer and the corresponding one of the Mo—Cu layers.