US 11,876,028 B2
Package with electrically insulated carrier and at least one step on encapsulant
Edward Fuergut, Dasing (DE); Chii Shang Hong, Melaka (MY); Teck Sim Lee, Melaka (MY); Bernd Schmoelzer, Radenthein (AT); Ke Yan Tean, Melaka (MY); and Lee Shuang Wang, Melaka (MY)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Oct. 15, 2021, as Appl. No. 17/502,082.
Claims priority of application No. 10 2020 130 612.1 (DE), filed on Nov. 19, 2020.
Prior Publication US 2022/0157682 A1, May 19, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3121 (2013.01) [H01L 21/56 (2013.01); H01L 23/49506 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49568 (2013.01); H01L 23/49838 (2013.01); H01L 24/46 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package having a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base, wherein the package comprises:
a carrier;
an electronic component mounted at the carrier;
an encapsulant encapsulating at least part of the electronic component and at least part of the carrier;
electrically insulating material covering electrically conductive material of the carrier at said first main face;
wherein the encapsulant comprises at least one step at the first main face; and
wherein a sum of a height of the at least one step and a height of the electrically insulating material is at least 0.25 mm.