US 11,876,007 B2
Hermetically sealed housing with a semiconductor component and method for manufacturing thereof
Rainer Markus Schaller, Saal a.d. Donau (DE); and Horst Theuss, Wenzenbach (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Feb. 18, 2022, as Appl. No. 17/651,612.
Application 17/651,612 is a division of application No. 16/158,438, filed on Oct. 12, 2018, granted, now 11,289,353.
Claims priority of application No. 102017125140.5 (DE), filed on Oct. 26, 2017.
Prior Publication US 2022/0172971 A1, Jun. 2, 2022
Int. Cl. H01L 21/673 (2006.01); H01L 23/049 (2006.01); H01L 23/20 (2006.01); H01L 21/67 (2006.01); B81C 1/00 (2006.01)
CPC H01L 21/67376 (2013.01) [B81C 1/00285 (2013.01); H01L 21/67126 (2013.01); H01L 21/67393 (2013.01); H01L 23/049 (2013.01); H01L 23/20 (2013.01); B81C 2203/0145 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A hermetically sealed housing, comprising:
a housing body comprising a cavity,
wherein a semiconductor component is in the cavity; and
a housing cover,
wherein the housing cover closes off a cavity of the housing body and is attached to the housing body,
wherein a predetermined gas atmosphere remains in the cavity, and
wherein the housing body, the housing cover, or a connection between the housing body and the housing cover has a plurality of openings; and
a material sealing the plurality of openings.