CPC H01L 21/67376 (2013.01) [B81C 1/00285 (2013.01); H01L 21/67126 (2013.01); H01L 21/67393 (2013.01); H01L 23/049 (2013.01); H01L 23/20 (2013.01); B81C 2203/0145 (2013.01)] | 20 Claims |
1. A hermetically sealed housing, comprising:
a housing body comprising a cavity,
wherein a semiconductor component is in the cavity; and
a housing cover,
wherein the housing cover closes off a cavity of the housing body and is attached to the housing body,
wherein a predetermined gas atmosphere remains in the cavity, and
wherein the housing body, the housing cover, or a connection between the housing body and the housing cover has a plurality of openings; and
a material sealing the plurality of openings.
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