US 11,876,006 B2
Heat treatment method and heat treatment apparatus of light irradiation type
Tomohiro Ueno, Kyoto (JP); Takahiro Kitazawa, Kyoto (JP); and Yoshihide Nozaki, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Jul. 1, 2020, as Appl. No. 16/918,049.
Claims priority of application No. 2019-151893 (JP), filed on Aug. 22, 2019.
Prior Publication US 2021/0057245 A1, Feb. 25, 2021
Int. Cl. H01L 21/268 (2006.01); H01L 21/324 (2006.01); H01L 21/263 (2006.01); G01J 5/00 (2022.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67248 (2013.01) [G01J 5/0007 (2013.01); H01L 21/2636 (2013.01); H01L 21/2686 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01); H01L 21/68707 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A heat treatment method for heating a substrate formed with a thin film by irradiating the substrate with a flash of light, the heat treatment method comprising the steps of:
(a) calculating emissivity of said substrate as viewed from a radiation thermometer based on the following information;
a material of said thin film formed on said substrate, a film thickness of said thin film and a layer structure of said thin film;
a base material of said substrate; and
an installation angle of said radiation thermometer that measures temperature of said substrate;
(b) calculating a weighted average efficiency of the emissivity of said substrate based on a sensitivity distribution in a measurement wavelength of said radiation thermometer, and
(c) setting said weighted average efficiency of said emissivity calculated in said step (b) in said radiation thermometer to measure the temperature of said substrate heated by irradiation with a flash of light using said radiation thermometer.