US 11,876,002 B2
Method for interconnecting components of an electronic system by sintering
Maxime Bronchy, Grenoble (FR); Etienne Duguet, Begles (FR); Céline Feautrier, Grenoble (FR); and Mona Treguer-Delapierre, Villenave d'Ornon (FR)
Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR); CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris (FR); UNIVERSITE DE BORDEAUX, Bordeaux (FR); and INSTITUT POLYTECHNIQUE DE BORDEAUX, Paris (FR)
Filed by COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR); CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris (FR); UNIVERSITE DE BORDEAUX, Bordeaux (FR); and INSTITUT POLYTECHNIQUE DE BORDEAUX, Talence (FR)
Filed on Sep. 2, 2021, as Appl. No. 17/446,767.
Claims priority of application No. 20 08955 (FR), filed on Sep. 3, 2020.
Prior Publication US 2022/0068664 A1, Mar. 3, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 21/477 (2006.01); B22F 3/24 (2006.01)
CPC H01L 21/4814 (2013.01) [B22F 3/24 (2013.01); H01L 21/477 (2013.01); B22F 2998/10 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method for interconnecting components of an electronic system, the method comprising the steps of:
a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles,
the metal nanoparticles comprising for more than 95.0% of their mass a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8,
the stabilizing agent is one or more surfactants customized so that during elimination of the solvent, the metal nanoparticles assemble in a least one ordered agglomerate,
b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one ordered agglomerate in which the metal nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the metal nanoparticles at a distance from each other,
c) debinding and sintering the interconnection layer, and
d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.