US 11,874,967 B2
Force sensing module with vibration feedback
Chin-Sung Liu, Hsinchu (TW); Shin-Ter Tsai, Hsinchu (TW); and Hsiao-Ming Chien, Hsinchu (TW)
Assigned to TOPRAY MEMS INC., Hsinchu (TW)
Filed by TOPRAY MEMS INC., Hsinchu (TW)
Filed on May 25, 2022, as Appl. No. 17/752,904.
Claims priority of application No. 111114897 (TW), filed on Apr. 19, 2022.
Prior Publication US 2023/0333656 A1, Oct. 19, 2023
Int. Cl. G06F 3/01 (2006.01); G01L 1/12 (2006.01)
CPC G06F 3/016 (2013.01) [G01L 1/122 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A force sensing module with vibration feedback, comprising:
a substrate, provided with at least one tactile actuator, and the substrate having a touch operation surface and a mounting surface on opposite sides, the tactile actuator being mounted on the mounting surface;
a frame, disposed with at least three buffer spacers, the buffer spacers connecting the frame to the substrate; and
a plurality of magnetic sensors, each magnetic sensor further comprising: a magnet and a Hall element, one of the magnet and the Hall element being disposed on the frame, the other one of the magnet and the Hall element being disposed on the substrate, and the positions of the magnet and the Hall element corresponding to each other and separated by a gap in a vertical direction; when a force applied to the touch operation surface causes the substrate to generate an offset and the magnet to approach the Hall element, the Hall element outputting a force signal representing a voltage change caused by the approaching magnet;
wherein the magnetic sensor is located adjacent to a corresponding buffer spacer with a gap in a lateral direction between the magnetic sensor and the corresponding buffer spacer.