CPC G03F 1/72 (2013.01) [G03F 1/84 (2013.01); H01L 21/0337 (2013.01); H01L 21/31144 (2013.01)] | 20 Claims |
1. A method of improving mask data used in fabrication of a semiconductor device, the method comprising:
setting a threshold value associated with a defect based on stochastic failure rate of the defect;
performing a first optimal proximity correction (OPC) of the mask data using nominal values of mask pattern contours;
identifying locations within the first OPC mask data where stochastically determined mask pattern contours correspond to a potential defect;
placing check figures on the identified locations to enable measurement of distances between the stochastically determined mask pattern contours; and
performing, by a processor, a second OPC of the first OPC mask data so as to cause the measured distances to be greater than the threshold value.
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