US 11,874,565 B2
Display substrate, manufacturing method thereof and display panel
Chunguang Tian, Beijing (CN); Tianyu Xia, Beijing (CN); and Xiaolong Li, Beijing (CN)
Assigned to Beijing BOE Display Technology Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/312,306
Filed by Beijing BOE Display Technology Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Dec. 30, 2020, PCT No. PCT/CN2020/141353
§ 371(c)(1), (2) Date Jun. 9, 2021,
PCT Pub. No. WO2021/190049, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 202010229050.2 (CN), filed on Mar. 27, 2020.
Prior Publication US 2023/0359090 A1, Nov. 9, 2023
Int. Cl. G02F 1/1343 (2006.01); G02F 1/1362 (2006.01); G02F 1/1333 (2006.01)
CPC G02F 1/134309 (2013.01) [G02F 1/133345 (2013.01); G02F 1/136286 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A display substrate, comprising a display region and a peripheral region surrounding the display region, wherein the display substrate comprises:
a common electrode line extending in a first direction on a base substrate, wherein the common electrode line is arranged at both the display region and the peripheral region;
a first conductive pattern arranged at the peripheral region and electrically connected to the common electrode line;
an insulation layer covering the first conductive pattern and the common electrode line, wherein a via-hole is formed in the insulation layer, and an orthogonal projection of the via-hole onto the base substrate does not overlap an orthogonal projection of the common electrode line onto the base substrate; and
a second conductive pattern arranged at the peripheral region and at a side of the insulation layer distal to the first conductive pattern, wherein the second conductive pattern is electrically connected to the first conductive pattern through the via-hole.