US 11,873,424 B2
Tape member and electronic apparatus including same
Daum Hwang, Gyeonggi-do (KR); and Sangin Baek, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Appl. No. 17/262,806
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
PCT Filed May 29, 2019, PCT No. PCT/KR2019/006442
§ 371(c)(1), (2) Date Jan. 25, 2021,
PCT Pub. No. WO2020/054943, PCT Pub. Date Mar. 19, 2020.
Claims priority of application No. 10-2018-0107616 (KR), filed on Sep. 10, 2018.
Prior Publication US 2021/0309901 A1, Oct. 7, 2021
Int. Cl. C09J 183/04 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); C09J 175/04 (2006.01); H05K 5/00 (2006.01); H05K 9/00 (2006.01)
CPC C09J 183/04 (2013.01) [B32B 7/12 (2013.01); B32B 27/08 (2013.01); C09J 175/04 (2013.01); H05K 5/0017 (2013.01); H05K 9/0024 (2013.01); B32B 2405/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/208 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing including a first plate, a second plate facing in an opposite direction to the first plate, and a lateral member surrounding a space between the first plate and the second plate;
a printed circuit board (PCB) disposed in the space and having at least one electric element mounted thereon;
a shield can mounted on the PCB and disposed to surround at least in part the at least one electric element; and
an insulating tape member attached to an inner surface of the shield can between the shield can and the electric element, and including:
a first layer containing a first material and formed to have a first thickness;
a second layer laminated on the first layer with an adhesive, containing a second material, and formed to have a second thickness equal to or greater than the first thickness; and
an adhesive layer formed on the second layer and attached to the shield can.