	US 11,873,414 B2
	Sealing resin composition, electronic component device, and method of manufacturing electronic component device
Yuma Takeuchi, Tokyo (JP); Hisato Takahashi, Tokyo (JP); and Yoshihito Inaba, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
Filed on Aug. 3, 2021, as Appl. No. 17/392,529.
Application 17/392,529 is a continuation of application No. 16/341,764, granted, now 11,186,742, previously published as PCT/JP2017/034810, filed on Sep. 26, 2017.
Claims priority of application No. 2016-202714 (JP), filed on Oct. 14, 2016.
Prior Publication US 2021/0363380 A1, Nov. 25, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C09D 163/00 (2006.01); C09D 7/61 (2018.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); C08K 3/00 (2018.01)

CPC C09D 163/00 (2013.01) [C08G 59/50 (2013.01); C08K 3/00 (2013.01); C08L 63/00 (2013.01); C09D 7/61 (2018.01); H01L 21/56 (2013.01); H01L 23/29 (2013.01); H01L 23/295 (2013.01); H01L 23/31 (2013.01); H01L 23/3121 (2013.01)]

15 Claims

1. A sealing resin composition comprising:

an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein:

the inorganic filler (C) comprises a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 60 nm, and

a value obtained by multiplying a specific surface area of the inorganic filler (C) by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition is from 5.4 m²/g to 30 m²/g.