US 11,873,399 B2
Resin composition, polishing pad, and method for producing polishing pad
Ryujin Ishiuchi, Tokyo (JP); and Nobuyuki Takahashi, Tokyo (JP)
Assigned to Resonac Corporation, Tokyo (JP)
Appl. No. 16/977,719
Filed by SHOWA DENKO K.K., Tokyo (JP)
PCT Filed Jan. 21, 2019, PCT No. PCT/JP2019/001706
§ 371(c)(1), (2) Date Sep. 2, 2020,
PCT Pub. No. WO2019/225055, PCT Pub. Date Nov. 28, 2019.
Claims priority of application No. 2018-097985 (JP), filed on May 22, 2018.
Prior Publication US 2021/0054192 A1, Feb. 25, 2021
Int. Cl. C08L 67/07 (2006.01); B24B 37/24 (2012.01); C08L 33/10 (2006.01); B24D 18/00 (2006.01); C08F 283/01 (2006.01); C08F 290/06 (2006.01); C08L 51/08 (2006.01)
CPC C08L 67/07 (2013.01) [B24B 37/24 (2013.01); C08L 33/10 (2013.01)] 15 Claims
 
1. A resin composition comprising:
a urethane (meth)acrylate (A),
an unsaturated resin (B) consisting of at least one of a vinyl ester resin and an unsaturated polyester resin,
an ethylenically unsaturated compound (C) having an ethylenically unsaturated bond and excluding the urethane (meth)acrylate (A) and the unsaturated resin (B), and
a hollow body (D),
wherein the urethane (meth)acrylate (A) is represented by the following general formula,

OG Complex Work Unit Chemistry
wherein R1 is H or CH3, R2 is a divalent hydrocarbon group which may contain an ether bond and in which a hydrogen atom may be substituted with a substituent, R3 is a divalent hydrocarbon group, and R4 is a structural unit derived from a polyester polyol having a weight-average molecular weight of 2,000 to 8,000, and n, which is the number of repeating units, is an average value based on the number of the entire urethane (meth)acrylate (A) contained in the resin composition and is a real number of 1.00 or greater,
wherein a mass ratio A:B of the content of the urethane (meth)acrylate (A) and the content of the unsaturated resin (B) is 64:36 to 96:4,
wherein the content of the hollow body (D) with respect to 100 parts by mass of the total of the urethane (meth)acrylate (A), the unsaturated resin (B) and the ethylenically unsaturated compound (C) is 0.7 to 9.0 parts by mass,
wherein the value of n in the general formula is 1.00 to 6.00, and
wherein the unsaturated resin (B) is an epoxy (meth)acrylate having a weight-average molecular weight of 1,000 to 6,000, or an unsaturated polyester resin having a weight-average molecular weight of 6,000 to 35,000.