US 11,873,398 B2
Interlayer insulating material and multilayer printed wiring board
Tatsushi Hayashi, Tsukuba (JP); Takashi Nishimura, Tsukuba (JP); and Susumu Baba, Tsukuba (JP)
Assigned to SEKISUI CHEMICAL CO., LTD., Osaka (JP)
Appl. No. 16/336,447
Filed by SEKISUI CHEMICAL CO., LTD., Osaka (JP)
PCT Filed Sep. 28, 2017, PCT No. PCT/JP2017/035273
§ 371(c)(1), (2) Date Mar. 25, 2019,
PCT Pub. No. WO2018/062404, PCT Pub. Date Apr. 5, 2018.
Claims priority of application No. 2016-191675 (JP), filed on Sep. 29, 2016.
Prior Publication US 2021/0284833 A1, Sep. 16, 2021
Int. Cl. C08L 63/00 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); B32B 15/092 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01)
CPC C08L 63/00 (2013.01) [B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/38 (2013.01); H05K 1/0298 (2013.01); H05K 1/0353 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); H05K 2201/0154 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An interlayer insulating material capable of being used in a multilayer printed wiring board, comprising:
an epoxy compound;
a curing agent;
a silica;
a polyimide; and
optionally, a solvent,
the epoxy compound containing an epoxy compound having a biphenyl skeleton,
the curing agent containing an active ester compounds,
the polyimide being a reactant of a tetracarboxylic anhydride and a dimer acid diamine, the polyimide having an amino group at the terminal thereof or an acid anhydride group at the terminal thereof,
a content of the silica being 60% by weight or more and 90% by weight or less in 100% by weight of components excluding any solvent in the interlayer insulating material,
a total content of the epoxy compound and the curing agent being 65% by weight or more in 100% by weight of components excluding the silica and any solvent in the interlayer insulating material, and
a content of the epoxy compound in 100% by weight of components excluding the silica and any solvent in the interlayer insulating material being larger than a content of the polyimide in 100% by weight of components excluding the silica and any solvent in the interlayer insulating material.