US 11,872,802 B2
Pattern transfer apparatus and pattern transfer method
Linhui Gong, Beijing (CN); Chao Liu, Beijing (CN); Qiangwei Cui, Beijing (CN); Ke Meng, Beijing (CN); and Haiwei Sun, Beijing (CN)
Assigned to BOE MLED TECHNOLOGY CO., LTD., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/310,292
Filed by BOE MLED TECHNOLOGY CO., LTD., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Jan. 12, 2021, PCT No. PCT/CN2021/071181
§ 371(c)(1), (2) Date Jul. 27, 2021,
PCT Pub. No. WO2021/155736, PCT Pub. Date Aug. 12, 2021.
Claims priority of application No. 202010082053.8 (CN), filed on Feb. 6, 2020.
Prior Publication US 2022/0314598 A1, Oct. 6, 2022
Int. Cl. B41F 16/00 (2006.01)
CPC B41F 16/00 (2013.01) 18 Claims
OG exemplary drawing
 
1. A pattern transfer method, comprising:
transferring a pattern to a flexible printing substrate; and
transferring the pattern on the printing substrate to a bending surface of a rigid carrier through an elastic rubber head,
wherein the rigid carrier is a rigid substrate, the bending surface comprises a first edge area of a first surface facing the printing substrate and a side surface adjacent to the first edge area, in response to the rigid substrate being located at a position to be transferred;
wherein the rigid substrate is a glass substrate; and
wherein the pattern on the printing substrate is transferred to the bending surface comprising the side surface of the glass substrate.