US 11,872,647 B2
Production method of additive manufactured object using pure copper powder having Si coating
Hirofumi Watanabe, Ibaraki (JP); Hiroyoshi Yamamoto, Ibaraki (JP); Yoshitaka Shibuya, Ibaraki (JP); Kenji Sato, Tokyo (JP); Satoru Morioka, Tokyo (JP); Akihiko Chiba, Miyagi (JP); and Kenta Aoyagi, Miyagi (JP)
Assigned to JX METALS CORPORATION, Tokyo (JP)
Appl. No. 16/978,822
Filed by JX Nippon Mining & Metals Corporation, Tokyo (JP)
PCT Filed Dec. 26, 2019, PCT No. PCT/JP2019/051093
§ 371(c)(1), (2) Date Sep. 8, 2020,
PCT Pub. No. WO2020/138274, PCT Pub. Date Jul. 2, 2020.
Claims priority of application No. 2018-244933 (JP), filed on Dec. 27, 2018; and application No. 2019-162390 (JP), filed on Sep. 5, 2019.
Prior Publication US 2021/0039192 A1, Feb. 11, 2021
Int. Cl. B23K 15/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/10 (2020.01); B22F 1/05 (2022.01); B22F 1/16 (2022.01); B22F 10/34 (2021.01); B22F 10/36 (2021.01); B22F 1/00 (2022.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01)
CPC B23K 15/0086 (2013.01) [B22F 1/00 (2013.01); B22F 1/05 (2022.01); B22F 1/16 (2022.01); B22F 10/34 (2021.01); B22F 10/36 (2021.01); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 2301/10 (2013.01); B22F 2302/45 (2013.01); B22F 2304/10 (2013.01)] 12 Claims
 
1. A production method of an additive manufactured object according to an EB-based (Electron Beam based) additive manufacturing method of spreading a pure copper powder, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a first layer, newly spreading the pure copper powder on the first layer, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with the electron beam, solidifying the pure copper powder to form a second layer, and repeating the foregoing process to add layers, wherein the pure copper powder is the pure copper powder with a Si coating formed thereon in which a Si adhesion amount is 5 to 200 wtppm, a C adhesion amount is 15 wtppm or more, and a weight ratio C/Si is 3 or less, and wherein the preheating temperature is set to be 400° C. or higher and less than 800° C.