	US 11,872,624 B2
	Copper alloy powder having Si coating film and method for producing same
Hirofumi Watanabe, Ibaraki (JP); and Yoshitaka Shibuya, Ibaraki (JP)
Assigned to JX METALS CORPORATION, Tokyo (JP)
Appl. No. 17/771,552
Filed by JX Nippon Mining & Metals Corporation, Tokyo (JP)
PCT Filed Jun. 25, 2021, PCT No. PCT/JP2021/024219 § 371(c)(1), (2) Date Apr. 25, 2022, PCT Pub. No. WO2021/261591, PCT Pub. Date Dec. 30, 2021.
Claims priority of application No. 2020-110405 (JP), filed on Jun. 26, 2020.
Prior Publication US 2022/0362844 A1, Nov. 17, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B22F 1/16 (2022.01); B22F 1/05 (2022.01)

CPC B22F 1/16 (2022.01) [B22F 1/05 (2022.01); B22F 2301/10 (2013.01); B22F 2304/10 (2013.01); Y10T 428/12181 (2015.01)]

20 Claims

1. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm⁻¹exists in a range of 1200 to 1850 cm⁻¹.