CPC A61N 1/05 (2013.01) [A61N 1/3752 (2013.01); B23K 20/026 (2013.01); B23K 26/21 (2015.10); C23C 14/10 (2013.01); C23C 14/18 (2013.01); C23C 14/34 (2013.01); H01R 13/187 (2013.01); H01R 24/58 (2013.01); H01R 43/0221 (2013.01); A61B 2562/227 (2013.01); B23K 2101/38 (2018.08); B23K 2103/172 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); H01R 2107/00 (2013.01); H01R 2201/12 (2013.01); Y10T 156/10 (2015.01)] | 17 Claims |
1. A medical device lead connector comprising:
electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment, the electrically conducting contact ring and the insulating ring having an interface bond on an atomic level, a metallization layer disposed on the electrically insulating ring at the interface bond, the metallization layer having a thickness in a range from 10 nanometers to less than 1 micrometer.
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