US 11,872,392 B2
Diffusion bonded lead connector
Darren A. Janzig, Center City, MN (US); Andrew J. Thom, Maple Grove, MN (US); Chris J. Paidosh, St. Anthony, MN (US); Brad C. Tischendorf, Minneapolis, MN (US); and Gerald G. Lindner, Lino Lakes, MN (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Filed by Medtronic, Inc., Minneapolis, MN (US)
Filed on Nov. 29, 2021, as Appl. No. 17/536,360.
Application 17/536,360 is a continuation of application No. 15/363,178, filed on Nov. 29, 2016, granted, now 11,213,673.
Application 15/363,178 is a continuation of application No. 13/088,913, filed on Apr. 18, 2011, abandoned.
Claims priority of provisional application 61/329,260, filed on Apr. 29, 2010.
Prior Publication US 2022/0080188 A1, Mar. 17, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/05 (2006.01); H01R 13/187 (2006.01); H01R 24/58 (2011.01); A61N 1/375 (2006.01); B23K 26/21 (2014.01); B23K 20/02 (2006.01); C23C 14/10 (2006.01); C23C 14/18 (2006.01); C23C 14/34 (2006.01); H01R 43/02 (2006.01); B23K 101/38 (2006.01); B23K 103/00 (2006.01); B23K 103/16 (2006.01); H01R 107/00 (2006.01)
CPC A61N 1/05 (2013.01) [A61N 1/3752 (2013.01); B23K 20/026 (2013.01); B23K 26/21 (2015.10); C23C 14/10 (2013.01); C23C 14/18 (2013.01); C23C 14/34 (2013.01); H01R 13/187 (2013.01); H01R 24/58 (2013.01); H01R 43/0221 (2013.01); A61B 2562/227 (2013.01); B23K 2101/38 (2018.08); B23K 2103/172 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); H01R 2107/00 (2013.01); H01R 2201/12 (2013.01); Y10T 156/10 (2015.01)] 17 Claims
OG exemplary drawing
 
1. A medical device lead connector comprising:
electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment, the electrically conducting contact ring and the insulating ring having an interface bond on an atomic level, a metallization layer disposed on the electrically insulating ring at the interface bond, the metallization layer having a thickness in a range from 10 nanometers to less than 1 micrometer.