US 12,200,904 B2
Immersion cooling system and immersion cooling method
Wei-Chih Lin, Taoyuan (TW); Ren-Chun Chang, Taoyuan (TW); Yan-Hui Jian, Taoyuan (TW); Wen-Yin Tsai, Taoyuan (TW); and Li-Hsiu Chen, Taoyuan (TW)
Assigned to DELTA ELECTRONICS, INC., Taoyuan (TW)
Filed by DELTA ELECTRONICS, INC., Taoyuan (TW)
Filed on Jun. 5, 2022, as Appl. No. 17/805,467.
Claims priority of provisional application 63/223,984, filed on Jul. 21, 2021.
Claims priority of application No. 202210157534.X (CN), filed on Feb. 21, 2022.
Prior Publication US 2023/0022650 A1, Jan. 26, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 7/20236 (2013.01); H05K 7/20263 (2013.01); H05K 7/20772 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An immersion cooling system, comprising:
a cooling tank configured to accommodate a liquid coolant and an electronic device, the electronic device being immersed in the liquid coolant; and
a filtration system, comprising:
a pipeline in fluid communication with the cooling tank;
a pump disposed in the pipeline and configured to drive the liquid coolant to flow through the pipeline;
a filter disposed in the pipeline and configured to filter the liquid coolant; and
a cooling device connected to the pipeline and configured to cool the liquid coolant, wherein the pipeline has an inlet connected to the cooling tank, and the cooling device is located between the pump and the inlet of the pipeline, and wherein the cooling device is directly connected to an input port of the pump via the pipeline.