US 11,871,577 B2
Semiconductor storage device and manufacturing method thereof
Takayuki Kashima, Yokkaichi Mie (JP); and Hiroyasu Sato, Yokkaichi Mie (JP)
Assigned to KIOXIA CORPORATION, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Sep. 2, 2020, as Appl. No. 17/010,195.
Claims priority of application No. 2020-012717 (JP), filed on Jan. 29, 2020.
Prior Publication US 2021/0233925 A1, Jul. 29, 2021
Int. Cl. H10B 43/50 (2023.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01); H10B 43/40 (2023.01)
CPC H10B 43/50 (2023.02) [H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/32136 (2013.01); H01L 21/32139 (2013.01); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10B 43/40 (2023.02)] 11 Claims
OG exemplary drawing
 
1. A semiconductor storage device, comprising:
a stacked body including a plurality of first insulating layers and a plurality of conductive layers alternately stacked in a first direction, the plurality of conductive layers including at least one first conductive layer functioning as a select gate, a plurality of second conductive layers each functioning as a word line, and at least one third conductive layer provided between the at least one first conductive layer and the plurality of second conductive layers in the first direction and functioning as a dummy word line;
a plurality of columnar portions that penetrate the stacked body, the plurality of columnar portions each including a first columnar portion and a second columnar portion adjacent to the first columnar portion in a second direction crossing the first direction;
a first slit extending in the first direction and a third direction crossing the first direction and the second direction, the first slit dividing the at least one first conductive layer and an upper portion of the at least one first columnar portion, the first slit not dividing the plurality of second conductive layers or the at least one second columnar portion; and
a second insulating layer that overlays an opening of the first slit, which forms a cavity.