US 11,871,523 B2
Electronic component module and method for manufacturing electronic component module
Ryohei Okabe, Nagaokakyo (JP); and Toru Komatsu, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on May 10, 2022, as Appl. No. 17/662,687.
Application 17/662,687 is a continuation of application No. PCT/JP2020/043596, filed on Nov. 24, 2020.
Claims priority of application No. 2019-229956 (JP), filed on Dec. 20, 2019.
Prior Publication US 2022/0264748 A1, Aug. 18, 2022
Int. Cl. H05K 1/18 (2006.01); H05K 3/28 (2006.01); H01L 23/28 (2006.01); H05K 9/00 (2006.01)
CPC H05K 3/284 (2013.01) [H01L 23/28 (2013.01); H05K 1/181 (2013.01); H05K 9/0073 (2013.01); H05K 2203/025 (2013.01); H05K 2203/0264 (2013.01); H05K 2203/107 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic component module comprising:
a substrate having a first main surface and a second main surface, the second main surface being a mount side;
a first electronic component mounted on the first main surface and having a facing surface facing the substrate and an opposite surface opposite to the facing surface;
an insulating resin covering a side of the first main surface; and
a shield film covering the insulating resin, wherein
the opposite surface is exposed from the insulating resin,
the shield film covers the opposite surface,
the opposite surface has an uneven portion,
the opposite surface has a printing groove, and a depth of the printing groove is larger than a surface roughness of the uneven portion, and
a concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.