US 11,870,202 B2
Solid-state power amplifiers with cooling capabilities
Rajesh Kumar Putti, Singapore (SG); Vinodh Ramachandran, Singapore (SG); Ananthkrishna Jupudi, Singapore (SG); Lean Wui Koh, Singapore (SG); and Prashant Agarwal, Singapore (SG)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Sep. 2, 2020, as Appl. No. 17/009,851.
Prior Publication US 2022/0069536 A1, Mar. 3, 2022
Int. Cl. H03F 1/52 (2006.01); H01S 3/041 (2006.01); H01S 3/067 (2006.01); H01S 3/042 (2006.01); H01S 3/23 (2006.01)
CPC H01S 3/041 (2013.01) [H01S 3/042 (2013.01); H01S 3/06779 (2013.01); H01S 3/06783 (2013.01); H01S 3/2308 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A processing chamber, comprising:
a power source;
an amplifier connected to the power source, comprising at least one of a gallium nitride (GaN) transistor or a gallium arsenide (GaAs) transistor, and
configured to amplify a power level of an input signal received from the power source to heat a substrate in a process volume;
a cooling plate configured to receive a coolant to cool the amplifier during operation, wherein the cooling plate includes a plurality of cooling channels configured to allow the coolant to flow within the cooling plate; and
a controller in communication with the amplifier and configured to control a flow of the coolant through the plurality of cooling channels.