CPC H01L 33/56 (2013.01) [H01L 33/0095 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01)] | 8 Claims |
1. A semiconductor light-emitting device comprising:
a substrate including an insulating base member and a conductive part;
a semiconductor light-emitting element supported on the substrate; and
a resin member covering at least a portion of the substrate,
wherein the insulating base member includes an obverse surface and a reverse surface that face away from each other in a thickness direction,
the conductive part includes a first portion formed on the obverse surface and a second portion separate from the first portion,
the semiconductor light-emitting element is mounted on the first portion,
the resin member includes a frame-shaped portion surrounding the semiconductor light-emitting element as viewed in the thickness direction, and an obverse-surface covering portion connected to the frame-shaped portion and covering a portion of the obverse surface of the insulating base member that is exposed from the first portion and the second portion,
the resin member covers a side surface of the first portion and a side surface of the second portion, and
the resin member is held in direct contact with the obverse surface of the insulating base member.
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