US 11,870,021 B2
Semiconductor light-emitting device and method for manufacturing the same
Tomoichiro Toyama, Kyoto (JP); and Ryo Kittaka, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by Rohm Co., Ltd., Kyoto (JP)
Filed on Jun. 14, 2022, as Appl. No. 17/840,296.
Application 17/840,296 is a continuation of application No. 16/725,484, filed on Dec. 23, 2019, granted, now 11,393,960.
Claims priority of application No. 2019-032442 (JP), filed on Feb. 26, 2019; application No. 2019-067019 (JP), filed on Mar. 29, 2019; and application No. 2019-185283 (JP), filed on Oct. 8, 2019.
Prior Publication US 2022/0310889 A1, Sep. 29, 2022
Int. Cl. H01L 33/56 (2010.01); H01L 33/00 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01)
CPC H01L 33/56 (2013.01) [H01L 33/0095 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor light-emitting device comprising:
a substrate including an insulating base member and a conductive part;
a semiconductor light-emitting element supported on the substrate; and
a resin member covering at least a portion of the substrate,
wherein the insulating base member includes an obverse surface and a reverse surface that face away from each other in a thickness direction,
the conductive part includes a first portion formed on the obverse surface and a second portion separate from the first portion,
the semiconductor light-emitting element is mounted on the first portion,
the resin member includes a frame-shaped portion surrounding the semiconductor light-emitting element as viewed in the thickness direction, and an obverse-surface covering portion connected to the frame-shaped portion and covering a portion of the obverse surface of the insulating base member that is exposed from the first portion and the second portion,
the resin member covers a side surface of the first portion and a side surface of the second portion, and
the resin member is held in direct contact with the obverse surface of the insulating base member.