US 11,869,839 B2
Package panel processing with integrated ceramic isolation
Woochan Kim, Sunnyvale, CA (US); Benjamin Allen Samples, Albany, OR (US); and Vivek Kishorechand Arora, San Jose, CA (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on May 11, 2021, as Appl. No. 17/317,873.
Application 17/317,873 is a division of application No. 16/263,110, filed on Jan. 31, 2019, granted, now 11,031,332.
Prior Publication US 2021/0280512 A1, Sep. 9, 2021
Int. Cl. H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 23/532 (2006.01); H01L 25/07 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/53228 (2013.01); H01L 24/09 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 28/40 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02381 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for fabricating a packaged electronic device, the method comprising:
attaching an organic panel frame to an adhesive carrier structure;
attaching a plurality of semiconductor dies to the adhesive carrier structure in openings of the organic panel frame;
forming a lamination structure in gaps between the organic panel frame and the semiconductor dies;
removing the adhesive carrier structure;
forming a redistribution layer (RDL) structure with a conductive structure electrically connected to contact structures of the semiconductor dies;
attaching a ceramic substrate to the semiconductor dies; and
separating a packaged electronic device from the panel.