US 11,869,795 B2
Mesa height modulation for thickness correction
Saketh Pemmasani, Hyderabad (IN); Akshay Dhanakshirur, Hubli (IN); Mayur Govind Kulkarni, Bangalore (IN); Madhu Santosh Kumar Mutyala, Santa Clara, CA (US); Hang Yu, San Jose, CA (US); and Deenesh Padhi, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 9, 2021, as Appl. No. 17/371,549.
Prior Publication US 2023/0008922 A1, Jan. 12, 2023
Int. Cl. H01L 21/683 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/6833 (2013.01) [C23C 16/4586 (2013.01); H01J 37/32697 (2013.01); H01J 37/32724 (2013.01); H01J 2237/3321 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A substrate support assembly, comprising:
a chuck body defining a substrate support surface, wherein:
the substrate support surface defines a plurality of protrusions that extend upward from the substrate support surface;
the substrate support surface defines first annular groove and a second annular groove;
the first annular groove and the second annular groove are radially spaced apart from one another;
a first subset of the plurality of protrusions are disposed within the first annular groove; and
a second subset of the plurality of protrusions are disposed within the second annular groove; and
a support stem coupled with the chuck body.