US 11,869,793 B2
Electrostatic chuck and substrate fixing device
Hiroyuki Kobayashi, Nagano (JP); and Akihiro Kuribayashi, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Jan. 28, 2021, as Appl. No. 17/160,911.
Claims priority of application No. 2020-014637 (JP), filed on Jan. 31, 2020.
Prior Publication US 2021/0242065 A1, Aug. 5, 2021
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67103 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electrostatic chuck that is configured to adsorb and retain an object thereon, the electrostatic chuck comprising:
a base body on which the object is mounted, the base body being an integral unitary body;
an electrostatic electrode that is provided in the base body;
a plurality of heating elements that are provided in the base body;
a plurality of current control elements that are provided in the base body, and each of which is connected in series with a corresponding one of the heating elements; and
a control circuit that is a semiconductor integrated circuit entirely built in the base body, and that is connected to the current control elements and configured to control operations of the current control elements.