CPC H01L 21/67288 (2013.01) [C23C 8/10 (2013.01); C23C 16/4587 (2013.01); H01L 21/67259 (2013.01); H01L 21/67303 (2013.01); H01L 21/67778 (2013.01); H01L 22/12 (2013.01)] | 22 Claims |
1. A method of manufacturing a semiconductor device, comprising:
(a) processing a substrate placed on a substrate retainer; and
(b) detecting a state of abnormality of the substrate placed on the substrate retainer after the substrate retainer is rotated by a first angle with respect to a transferable position, wherein the substrate is transferable by a substrate transport device to/from the substrate retainer in the transferable position, wherein the state of abnormality comprises a state where the substrate jumps out from the substrate retainer toward the substrate transport device.
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