	US 11,869,763 B2
	Apparatus and system for treating substrate
Jun Keon Ahn, Sejong-si (KR); Soo Young Park, Incheon (KR); Ohyeol Kwon, Cheonan-si (KR); Jung Hwan Lee, Pyeongtaek-si (KR); and Seungtae Yang, Yongin-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Apr. 29, 2020, as Appl. No. 16/861,387.
Claims priority of application No. 10-2019-0050434 (KR), filed on Apr. 30, 2019.
Prior Publication US 2020/0350156 A1, Nov. 5, 2020
Int. Cl. H01L 21/02 (2006.01); B23K 26/40 (2014.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B08B 7/00 (2006.01); B23K 26/08 (2014.01); B23K 26/0622 (2014.01); B23K 26/073 (2006.01); B23K 26/06 (2014.01); B23K 26/082 (2014.01); B23K 101/40 (2006.01)

CPC H01L 21/02098 (2013.01) [B08B 7/0042 (2013.01); B23K 26/0604 (2013.01); B23K 26/0622 (2015.10); B23K 26/0648 (2013.01); B23K 26/0665 (2013.01); B23K 26/073 (2013.01); B23K 26/082 (2015.10); B23K 26/0823 (2013.01); H01L 21/02087 (2013.01); H01L 21/67115 (2013.01); H01L 21/68764 (2013.01); B23K 2101/40 (2018.08)]

14 Claims

1. An apparatus for treating a substrate, the apparatus comprising:

a chamber defining an inner space;

a support unit received in the inner space and configured to support and rotate the substrate;

a first laser irradiation unit configured to perform an edge bead removal (EBR) process by firing a first laser beam having a first wavelength to remove an exposed upper first layer of an organic film on an upper surface of the substrate that is supported on the support unit; and

a second laser irradiation unit configured to perform the EBR process by firing a second laser beam having a second wavelength, different than the first wavelength, to remove a second layer of the organic film on the upper surface of the substrate that is supported on the support unit,

wherein the first and second wavelengths are between 150 nm and 380 nm.

10. The apparatus of claim 8, wherein an area of a seat surface of the pedestal is less than an area of the substrate.