US 11,869,701 B2
Circuit element
Hideaki Kobayashi, Nagaokakyo (JP); and Kentaro Mikawa, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Oct. 7, 2021, as Appl. No. 17/495,849.
Application 17/495,849 is a continuation of application No. PCT/JP2020/013265, filed on Mar. 25, 2020.
Claims priority of application No. 2019-104700 (JP), filed on Jun. 4, 2019.
Prior Publication US 2022/0028597 A1, Jan. 27, 2022
Int. Cl. H02H 1/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/40 (2006.01); H01F 41/04 (2006.01); H01G 4/40 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/29 (2013.01); H01F 27/40 (2013.01); H01F 41/043 (2013.01); H01G 4/40 (2013.01); H01F 2027/2809 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A circuit element comprising:
a multilayer body including insulating substrates;
a first coil conductor inside the multilayer body; and
a first outer electrode and a second outer electrode on an outer surface of the multilayer body; wherein
the first coil conductor includes a winding axis extending in a stacking direction of the insulating substrates;
the first coil conductor is connected to the first outer electrode or the second outer electrode;
the second outer electrode extends along a side surface of the multilayer body;
an additional capacitance is generated between the second outer electrode and the first coil conductor due to the second outer electrode and the first coil conductor being adjacent to or in a vicinity of each other;
the second outer electrode includes a first portion and a second portion having different widths from each other in a layer direction of the insulating substrates; and
the width of the second portion is larger than the width of the first portion.