	US 11,866,568 B2
	Component for telecommunication apparatus
Miki Tokuyama, Tokyo (JP); and Masahito Kuramitsu, Tokyo (JP)
Assigned to ASAHI KASEI KABUSHIKI KAISHA, Tokyo (JP)
Appl. No. 18/252,532
Filed by ASAHI KASEI KABUSHIKI KAISHA, Tokyo (JP)
PCT Filed Aug. 25, 2021, PCT No. PCT/JP2021/031202 § 371(c)(1), (2) Date May 11, 2023, PCT Pub. No. WO2022/107409, PCT Pub. Date May 27, 2022.
Claims priority of application No. 2020-191024 (JP), filed on Nov. 17, 2020.
Prior Publication US 2023/0391982 A1, Dec. 7, 2023
Int. Cl. C08K 3/22 (2006.01); C08L 71/12 (2006.01); H01Q 1/36 (2006.01)

CPC C08K 3/22 (2013.01) [C08L 71/123 (2013.01); H01Q 1/36 (2013.01); C08K 2003/2241 (2013.01); C08L 2205/035 (2013.01)]

11 Claims

1. A component for a telecommunication apparatus, the component comprising a molded product made of a resin composition,

wherein the resin composition comprises (a) a matrix resin and (b) titanium dioxide,

the (A) matrix resin comprises (A-a) a polyphenylene ether-based resin,

a sum of contents of the (A-a) polyphenylene ether-based resin, and (A-b) a block copolymer containing at least one block mainly composed of an aromatic vinyl monomer unit and at least one block mainly composed of a conjugated diene monomer unit and/or a hydrogenated product of the block copolymer with respect to 100 parts by mass of the (A) matrix resin is 75 parts by mass or more, and

an average L/D of the (B) titanium dioxide is 1.2 or more and 6.0 or less, and a content of titanium dioxide having an L/D of greater than 7.0 is less than 10%.