CPC C08G 59/245 (2013.01) [C08G 59/4021 (2013.01); C08K 5/0025 (2013.01); C08K 5/07 (2013.01); C08K 5/132 (2013.01); C08K 5/1515 (2013.01); C08K 5/17 (2013.01); C08K 5/21 (2013.01); C08L 9/00 (2013.01); C08L 75/04 (2013.01); C09J 7/35 (2018.01); C09J 163/00 (2013.01); C08L 2203/14 (2013.01); C08L 2207/53 (2013.01)] | 14 Claims |
1. A one-component thermosetting epoxy resin composition comprising:
a) at least one epoxy resin A having an average of more than one epoxy group per molecule;
b) at least one latent curing agent for epoxy resins B;
c) at least one compound of the formula
wherein:
substituents R1 and R2 are independently an unsubstituted benzene, a halogenated benzene, alkoxylated benzene, an alkylated benzene or an N derivative of an aniline,
substituent R3 is H or an alkyl group having 1 to 10 carbon atoms,
a weight ratio of the at least one epoxy resin A having an average of more than one epoxy group per molecule to the at least one compound of the formula (III) is 5-800,
the one-component thermosetting epoxy resin composition has a viscosity at 25° C. of 500-3000 Pa*s, and
the one-component thermosetting epoxy resin composition has a percentage rise in viscosity at 25° C. after storage for one week at 60° C. after mixing that is less than 90% of the corresponding percentage rise in viscosity of a one-component thermosetting epoxy resin composition that is the same except not having a compound of formula (III).
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