US 11,865,850 B2
Liquid ejecting apparatus and liquid ejecting head
Shingo Tomimatsu, Shiojiri (JP); Masahiko Sato, Azumino (JP); Hiroki Kobayashi, Matsumoto (JP); Osamu Yagi, Kyotanabe (JP); and Kenta Ono, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Feb. 28, 2022, as Appl. No. 17/681,947.
Claims priority of application No. 2021-031443 (JP), filed on Mar. 1, 2021.
Prior Publication US 2022/0305827 A1, Sep. 29, 2022
Int. Cl. B41J 25/34 (2006.01); B41J 2/14 (2006.01)
CPC B41J 25/34 (2013.01) [B41J 2/14201 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A liquid ejecting apparatus comprising:
a liquid ejecting head including:
head chips each including a nozzle plate including nozzles configured to eject a liquid;
a holder that is formed of resin, the holder holding the head chips and including a flow path for supplying the liquid to each of the head chips;
a holder cover that is formed of a material having a higher thermal conductivity than a thermal conductivity of the holder and houses the head chips and the holder; and
a fixing plate that is formed of metal and to which the holder cover and the head chips are fixed, the fixing plate including openings respectively exposing each of the nozzle plates;
a carriage on which the liquid ejecting head is mounted; and
a heater that is mounted on the carriage and heats the liquid inside each of the head chips via the holder cover and the fixing plate.