US 11,865,782 B2
Printing system and writing module thereof
Nir Rubin Ben Haim, Hod HaSharon (IL); Michael Nagler, Tel Aviv (IL); Abraham Keren, Maccabim Reut (IL); Ofer Aknin, Petach Tikva (IL); and Benzion Landa, Nes Ziona (IL)
Assigned to Landa Labs (2012) LTD., Rehovot (IL)
Appl. No. 16/635,162
Filed by LANDA LABS (2012) LTD., Rehovot (IL)
PCT Filed Aug. 8, 2018, PCT No. PCT/IB2018/055971
§ 371(c)(1), (2) Date Jan. 29, 2020,
PCT Pub. No. WO2019/030694, PCT Pub. Date Feb. 14, 2019.
Claims priority of application No. 1712726 (GB), filed on Aug. 8, 2017.
Prior Publication US 2020/0406544 A1, Dec. 31, 2020
Int. Cl. B29C 64/268 (2017.01); B33Y 30/00 (2015.01); B41J 2/005 (2006.01); B41J 2/455 (2006.01); G02B 3/00 (2006.01); G02B 3/06 (2006.01); G02B 19/00 (2006.01); H01S 5/024 (2006.01); H01S 5/183 (2006.01); H01S 5/40 (2006.01); H01S 5/42 (2006.01)
CPC B29C 64/268 (2017.08) [B33Y 30/00 (2014.12); B41J 2/0057 (2013.01); B41J 2/455 (2013.01); G02B 3/0087 (2013.01); G02B 3/06 (2013.01); G02B 19/0009 (2013.01); G02B 19/0047 (2013.01); H01S 5/02469 (2013.01); H01S 5/1833 (2013.01); H01S 5/18311 (2013.01); H01S 5/4018 (2013.01); H01S 5/426 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A printing system comprising:
a writing module;
a member having an imaging surface configured to carry a layer of particles of a radiation modifiable material, the member and the writing module being movable relative to each other;
the writing module comprising a plurality of integrated electronic modules each having an array having a plurality of individually controllable light sources;
each controllable light source comprising a cascade of at least two Vertical-Cavity Surface-Emitting Laser (VCSEL) light-emitting semiconductor junctions connected in series with one another and disposed to emit light along a common axis so as to direct a single beam onto a single spot on the imaging surface;
the plurality of spots from the respective plurality of light sources being spaced from one another in a direction transverse to the direction of movement between the writing module and the imaging surface.