CPC B29C 64/153 (2017.08) [B22F 10/28 (2021.01); B22F 10/40 (2021.01); B29C 64/245 (2017.08); B29C 64/255 (2017.08); B29C 64/295 (2017.08); B33Y 80/00 (2014.12); B22F 10/73 (2021.01); B22F 12/90 (2021.01); B29C 64/268 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12)] | 22 Claims |
1. A method for making a component at a device, wherein the device comprises a powder depot, a work space and a laser, wherein the work space comprises a powder bed and an assembly, and wherein the assembly comprises a thermally insulating embedding mass and a heat conducting mold, the method comprising:
fastening, by the assembly, an element at the work space; and
forming the component at the element by:
repeatedly moving, by a wiper, powder from the powder depot to the powder bed at the work space; and
heating, by a laser beam of the laser in an additive process, portions of the powder in the powder bed so that the component is built on the element,
wherein the additive process comprises selective laser melting (SLM) or selective laser sintering (SLS), and
wherein the embedding mass is independent and distinct from the powder and the component.
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