CPC B23K 20/007 (2013.01) [B23K 20/004 (2013.01); B23K 20/26 (2013.01); B23K 2101/40 (2018.08); H01L 24/85 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85035 (2013.01)] | 13 Claims |
1. A method of operating a wire bonding machine, the method comprising the steps of:
(a) incrementally decreasing a bonding force applied to a bond head assembly while detecting a z-height position of a portion of the bond head assembly, until the z-height position changes from an initial height by a predetermined height adjustment; and
(b) detecting a bonding force value upon the z-height position changing from the initial height by the predetermined height adjustment.
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