US 11,865,633 B2
Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
Hui Xu, Chalfont, PA (US); Wei Qin, Ambler, PA (US); and D. Matthew Odhner, Bryn Athyn, PA (US)
Assigned to Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed by Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed on Feb. 1, 2023, as Appl. No. 18/104,423.
Application 18/104,423 is a division of application No. 17/517,827, filed on Nov. 3, 2021, granted, now 11,597,031.
Claims priority of provisional application 63/110,012, filed on Nov. 5, 2020.
Prior Publication US 2023/0166348 A1, Jun. 1, 2023
Int. Cl. B23K 20/00 (2006.01); B23K 20/26 (2006.01); B23K 101/40 (2006.01); H01L 23/00 (2006.01)
CPC B23K 20/007 (2013.01) [B23K 20/004 (2013.01); B23K 20/26 (2013.01); B23K 2101/40 (2018.08); H01L 24/85 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85035 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method of operating a wire bonding machine, the method comprising the steps of:
(a) incrementally decreasing a bonding force applied to a bond head assembly while detecting a z-height position of a portion of the bond head assembly, until the z-height position changes from an initial height by a predetermined height adjustment; and
(b) detecting a bonding force value upon the z-height position changing from the initial height by the predetermined height adjustment.