CPC B01J 23/44 (2013.01) [B01J 31/0238 (2013.01); B01J 31/0254 (2013.01); B01J 31/0274 (2013.01); B01J 31/0275 (2013.01); B01J 31/06 (2013.01); B01J 35/006 (2013.01); B01J 35/0013 (2013.01); B01J 37/0209 (2013.01); B01J 37/031 (2013.01); C23C 18/1831 (2013.01); C23C 18/1879 (2013.01); C23C 18/206 (2013.01); C23C 18/30 (2013.01); B01J 31/0204 (2013.01); B01J 37/04 (2013.01); B01J 37/08 (2013.01); C23C 18/34 (2013.01)] | 20 Claims |
1. A method for manufacturing an electroless plating substrate, including:
providing a substrate;
attaching a self-adsorbed catalyst composition to a surface of the substrate, wherein the self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound, the colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle, and the silane compound has at least one amino group to interact with the colloidal nanoparticle, a covalent bond between the silane compound and the surface of the substrate is formed through a silane group of the silane compound, and the colloid nanoparticle has a particle size ranging from 5 to 10 nanometers; and
performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate.
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