US 11,865,518 B2
Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate
Tzu-Chien Wei, Hsinchu (TW); and Yu-Hsiang Kao, New Taipei (TW)
Assigned to NATIONAL TSING HUA UNIVERSITY, Hsinchu (TW)
Filed by National Tsing Hua University, Hsinchu (TW)
Filed on Oct. 20, 2020, as Appl. No. 17/075,130.
Application 17/075,130 is a continuation of application No. 16/133,935, filed on Sep. 18, 2018, granted, now 10,828,624.
Claims priority of application No. 106136175 (TW), filed on Oct. 20, 2017.
Prior Publication US 2021/0046455 A1, Feb. 18, 2021
Int. Cl. C23C 18/18 (2006.01); B01J 23/44 (2006.01); B01J 31/02 (2006.01); B01J 35/00 (2006.01); B01J 31/06 (2006.01); B01J 37/02 (2006.01); B01J 37/03 (2006.01); C23C 18/20 (2006.01); C23C 18/30 (2006.01); B01J 37/04 (2006.01); B01J 37/08 (2006.01); C23C 18/34 (2006.01)
CPC B01J 23/44 (2013.01) [B01J 31/0238 (2013.01); B01J 31/0254 (2013.01); B01J 31/0274 (2013.01); B01J 31/0275 (2013.01); B01J 31/06 (2013.01); B01J 35/006 (2013.01); B01J 35/0013 (2013.01); B01J 37/0209 (2013.01); B01J 37/031 (2013.01); C23C 18/1831 (2013.01); C23C 18/1879 (2013.01); C23C 18/206 (2013.01); C23C 18/30 (2013.01); B01J 31/0204 (2013.01); B01J 37/04 (2013.01); B01J 37/08 (2013.01); C23C 18/34 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing an electroless plating substrate, including:
providing a substrate;
attaching a self-adsorbed catalyst composition to a surface of the substrate, wherein the self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound, the colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle, and the silane compound has at least one amino group to interact with the colloidal nanoparticle, a covalent bond between the silane compound and the surface of the substrate is formed through a silane group of the silane compound, and the colloid nanoparticle has a particle size ranging from 5 to 10 nanometers; and
performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate.