US 10,893,615 B2
Printed circuit board composite and method for producing same
Juergen Rietsch, Wendelstein (DE); Andreas Plach, Forchheim (DE); Andreas Albert, Hoechstadt/Aisch (DE); Mathias Strecker, Crailsheim (DE); Hassene Bel Haj Said, Nuremberg (DE); Johannes Bock, Hersbruck (DE); and Thengis Greifenstein, Nuremberg (DE)
Assigned to CPT Zwei GmbH, Hannover (DE)
Appl. No. 16/468,820
Filed by CPT ZWEI GMBH, Hannover (DE)
PCT Filed Dec. 8, 2017, PCT No. PCT/EP2017/082109
§ 371(c)(1), (2) Date Jun. 12, 2019,
PCT Pub. No. WO2018/108758, PCT Pub. Date Jun. 21, 2018.
Claims priority of application No. 10 2016 224 653 (DE), filed on Dec. 12, 2016.
Prior Publication US 2020/0077525 A1, Mar. 5, 2020
Int. Cl. H05K 3/36 (2006.01)
CPC H05K 3/366 (2013.01) [H05K 2201/048 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10151 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for producing a printed circuit board composite, the method comprising:
connecting a first printed circuit board, being a sensor carrier printed circuit board, in a form-fitting connection to a second printed circuit board, being a supporting printed circuit board, wherein each of the first and second printed circuit boards have a groove with a groove bottom formed therein, and the first and second printed circuit boards are connected to one another such that the groove bottoms of the grooves fit in and contact one another; and
providing the first printed circuit board with a component and connecting the first and second printed circuit boards to one another such that the second printed circuit board contacts the component and supports the component in position.