US 10,893,613 B2
Manufacturing method for printed circuit board
Jong-Guk Kim, Suwon-si (KR); Chul-Min Lee, Suwon-si (KR); Sung-Jun Park, Suwon-si (KR); Dong-Chul Shin, Suwon-si (KR); Chang-Jae Lee, Suwon-si (KR); Seon-Hye Kim, Suwon-si (KR); Joong-Mo Hwang, Suwon-si (KR); Sim-Hwan Park, Suwon-si (KR); Myung-Gun Chong, Suwon-si (KR); and Tae-Wook Jung, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electro-Mechanics Co., Ltd., Suwon-Si (KR)
Filed on Nov. 29, 2017, as Appl. No. 15/825,511.
Claims priority of application No. 10-2016-0160463 (KR), filed on Nov. 29, 2016.
Prior Publication US 2018/0153043 A1, May 31, 2018
Int. Cl. H05K 3/06 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); H05K 3/18 (2006.01)
CPC H05K 3/06 (2013.01) [H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 3/002 (2013.01); H05K 3/381 (2013.01); H05K 3/388 (2013.01); H05K 3/4038 (2013.01); H05K 3/181 (2013.01); H05K 2203/0361 (2013.01); H05K 2203/0376 (2013.01); H05K 2203/075 (2013.01); H05K 2203/0759 (2013.01); H05K 2203/0789 (2013.01)] 13 Claims
OG exemplary drawing
1. A manufacturing method for a printed circuit board, comprising:
laminating a metal film on an insulating layer, the metal film comprising a first metal layer comprising one or more jagged surface having a roughness formed by peaks between valleys, and a second metal layer comprising a first surface in contact with the first metal layer and a second surface in contact with a surface of the insulating layer;
pressing the metal film toward the insulating layer such that the roughness is transferred to the surface of the insulating layer;
removing the first metal layer such that the first surface of the second metal layer is exposed; and
treating the first surface of the second metal layer with an acidic solution such that at least a portion of the second metal layer is removed from the surface of the insulating layer.