US 10,893,608 B2
Fabric having multiple layered circuit thereon integrating with electronic devices
Tzu-Wei Chou, Taipei (TW); Syang-Peng Rwei, Taipei (TW); Chien-Cheng Chen, Taipei (TW); and Guo-Ming Sung, Taipei (TW)
Assigned to National Taipei University of Technology, Taipei (TW)
Filed by National Taipei University of Technology, Taipei (TW)
Filed on Aug. 20, 2018, as Appl. No. 16/105,900.
Claims priority of application No. 106128896 A (TW), filed on Aug. 25, 2017.
Prior Publication US 2019/0069407 A1, Feb. 28, 2019
Int. Cl. H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01); B33Y 80/00 (2015.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01)
CPC H05K 1/118 (2013.01) [B33Y 80/00 (2014.12); H05K 1/0281 (2013.01); H05K 1/032 (2013.01); H05K 1/038 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 1/189 (2013.01); H05K 3/125 (2013.01); H05K 3/1216 (2013.01); H05K 3/1241 (2013.01); H05K 3/285 (2013.01); H05K 3/323 (2013.01); H05K 3/4664 (2013.01); H05K 3/284 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/068 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A fabric having a multiple layered circuit thereon integrating with an electronic device, comprising:
a base layer formed of a spacer fabric coated with thermoplastic resins;
a plurality of conductive circuit layers, formed on the base layer;
at least one connecting layer, comprising a plurality of via-holes made of a conductive material and a plurality of electrically insulated regions made of an insulating material and being positioned between any two adjacent conductive circuit layers of the plurality of conductive circuit layers wherein the via-holes electrically connect the two adjacent conductive circuit layers and the electrically insulated regions are distributed in areas other than the via-holes of the connecting layer;
at least one electronic device, mounted on and electrically connected to a circuit of the conductive circuit layer through an anisotropic conductive film; and
a waterproof layer, formed on the conductive circuit layer farthest away from the base layer;
wherein the anisotropic conductive film has a first surface and a second surface opposite to the first surface, the at least one electronic device is disposed on the first surface, all of the conductive circuit layers and the at least one connecting layer are disposed on the second surface and located between the anisotropic conductive film and the base layer, and at least one of the via-holes is in direct contact with one of the conductive circuit layers and in direct contact with the second surface of the anisotropic conductive film; and
wherein the absolute value of the difference between the thermal expansion coefficient of the material constituting the conductive circuit layer and the thermal expansion coefficient of the insulating material constituting the electrically insulated region of the connecting layer is less than 20% of the thermal expansion coefficient of the insulating material; and the absolute value of the difference between the thermal expansion coefficient of the insulating material of the connecting layer and the thermal expansion coefficient of the conductive material of the connecting layer is less than 20% of the thermal expansion coefficient of the insulating material of the connecting layer; the absolute value of the difference between the thermal expansion coefficient of the anisotropic conductive film and the thermal expansion coefficient of the insulating material of the connecting layer is less than 20% of the thermal expansion coefficient of the insulating material of the connecting layer.