US 10,892,730 B2
Acoustic filter with packaging-defined boundary conditions and method for producing the same
You Qian, Singapore (SG); Humberto Campanella-Pineda, Singapore (SG); and Rakesh Kumar, Singapore (SG)
Assigned to VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD., Singapore (SG)
Filed by VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD., Singapore (SG)
Filed on May 30, 2018, as Appl. No. 15/993,155.
Prior Publication US 2019/0372543 A1, Dec. 5, 2019
Int. Cl. H03H 9/02 (2006.01); H03H 3/02 (2006.01); H01L 41/053 (2006.01); H03H 9/56 (2006.01); H03H 9/13 (2006.01); H03H 9/205 (2006.01); H01L 41/047 (2006.01); H01L 41/23 (2013.01); H01L 41/187 (2006.01); H01L 41/193 (2006.01)
CPC H03H 9/02086 (2013.01) [H01L 41/0477 (2013.01); H01L 41/0533 (2013.01); H01L 41/23 (2013.01); H03H 3/02 (2013.01); H03H 9/02031 (2013.01); H03H 9/13 (2013.01); H03H 9/205 (2013.01); H03H 9/562 (2013.01); H03H 9/564 (2013.01); H01L 41/187 (2013.01); H01L 41/1873 (2013.01); H01L 41/193 (2013.01); H03H 2003/027 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A device comprising:
a first cavity in a dielectric layer;
a bulk acoustic wave (BAW) resonator over the first cavity and the dielectric layer, the BAW resonator comprising a first metal layer, a thin-film piezoelectric layer, and a second metal layer;
a second cavity over the first cavity on the second metal layer;
a pair of thin-film encapsulation (TFE) anchors on the second metal layer, each TFE anchor adjacent to and on an opposite side of the second cavity and extending beyond the first metal layer;
a TFE cap layer on the second metal layer and over the second cavity; and
a TFE seal layer over the TFE cap layer, wherein the pair of TFE anchors comprises the TFE cap layer on the second metal layer.