US 10,892,405 B2
Hall-effect sensor package with added current path
Ming Li, Plano, TX (US); Yiqi Tang, Allen, TX (US); Jie Chen, Dallas, TX (US); Enis Tuncer, Dallas, TX (US); Usman Mahmood Chaudhry, McKinney, TX (US); Tony Ray Larson, Tucson, AZ (US); Rajen Manicon Murugan, Dallas, TX (US); John Paul Tellkamp, Rockwall, TX (US); and Satyendra Singh Chauhan, Murphy, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on May 7, 2019, as Appl. No. 16/404,978.
Prior Publication US 2020/0357987 A1, Nov. 12, 2020
Int. Cl. H01L 43/04 (2006.01); H01L 43/06 (2006.01); H01L 43/14 (2006.01); G01R 15/20 (2006.01); H01L 23/495 (2006.01); G01R 33/07 (2006.01); G01R 33/00 (2006.01)
CPC H01L 43/14 (2013.01) [G01R 15/202 (2013.01); G01R 33/07 (2013.01); H01L 23/49548 (2013.01); H01L 43/065 (2013.01); G01R 33/0052 (2013.01)] 21 Claims
OG exemplary drawing
1. A Hall-effect sensor package, comprising:
an integrated circuit (IC) die including at least one Hall-effect sensor element and signal processing circuitry including at least an amplifier coupled to an output node of the Hall-effect element;
a leadframe including:
a plurality of leads including a first plurality of leads on a first side of the package providing a first field generating current (FGC) path including at least one first FGC input pin coupled by a reduced width first curved head over or under the Hall-effect sensor element to at least one first FGC output pin and a second plurality of leads on a second side of the package that is opposite to the first side;
wherein at least some of the plurality of leads on the second side are attached to bond pads on the IC die including to an output of the Hall-effect sensor element, and
a clip attached at one end to a location on the first FGC input pin and at another end to a location on the first FGC output pin with a reduced width second curved head in between that is over or under the Hall-effect sensor element opposite the first curved head for providing a parallel FGC path with respect to the first FGC path.