US 10,892,391 B2
Light-emitting device package including a lead frame
Ji-hoon Yun, Suwon-si (KR); Jong-sup Song, Hwaseong-si (KR); and Seol-young Choi, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 26, 2019, as Appl. No. 16/550,816.
Application 16/550,816 is a continuation of application No. 15/796,190, filed on Oct. 27, 2017, granted, now 10,510,936.
Claims priority of application No. 10-2017-0053563 (KR), filed on Apr. 26, 2017.
Prior Publication US 2020/0058839 A1, Feb. 20, 2020
Int. Cl. H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01)
CPC H01L 33/62 (2013.01) [H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 24/13 (2013.01); H01L 27/0248 (2013.01); H01L 27/0255 (2013.01); H01L 29/866 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/16257 (2013.01); H01L 2224/17106 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/3512 (2013.01); H01L 2933/0033 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting device package, comprising:
a lead frame comprising a first metallic lead and a second metallic lead that are spaced apart from each other in a first direction;
a light-emitting device chip mounted on a first area of the lead frame, the first area of the lead frame including a part of the first metallic lead and a part of the second metallic lead; and
a molding structure comprising:
an outer barrier surrounding at least a part of the lead frame, and
an electrode separator disposed between the first metallic lead and the second metallic lead and filling space between the first metallic lead and the second metallic lead, the electrode separator extending in a second direction intersecting the first direction,
wherein each of the first metallic lead and the second metallic lead comprises at least two inner slots formed to extend in the first direction, the at least two inner slots of the first metallic lead penetrating through the first metallic lead from an upper surface to a lower surface of the first metallic lead, the at least two inner slots of the second metallic lead penetrating through the second metallic lead from an upper surface to a lower surface of the second metallic lead, and,
wherein the molding structure comprises inner slot molding parts integrally connected to the electrode separator and filling the at least two inner slots of each of the first metallic lead and the second metallic lead.