US 10,892,383 B2
Light emitting diode package and method for fabricating same
Bernd Keller, Santa Barbara, CA (US); Thomas Cheng-Hsin Yuan, Ventura, CA (US); and Nicholas W Medendorp, Jr., Raleigh, NC (US)
Assigned to Cree, Inc., Durham, NC (US)
Filed by CREE, INC., Durham, NC (US)
Filed on May 6, 2015, as Appl. No. 14/705,228.
Application 14/705,228 is a division of application No. 11/982,275, filed on Oct. 31, 2007, granted, now 9,070,850.
Prior Publication US 2015/0236219 A1, Aug. 20, 2015
Int. Cl. H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 33/58 (2010.01); H01L 33/54 (2010.01)
CPC H01L 33/486 (2013.01) [H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 33/54 (2013.01); H01L 33/647 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01087 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for fabricating a plurality of surface mount Light Emitting Diode (LED) packages, comprising:
sizing a submount panel to accommodate formation of a plurality of LED packages;
forming sets of attach pads and contact pads on a first surface of said submount panel, each of said sets of attach pads and contact pads corresponding to one of said LED packages formed from said submount panel;
attaching a plurality of LEDs to said submount panel, each of said plurality of LEDs attached to an electrically connected to one of said sets of attach pads and contact pads;
molding a plurality of hemispherical lenses on said submount panel, each hemispherical lens in said plurality of hemispherical lenses coupled to the first surface of said submount panel and coupled over one LED in said plurality of said LEDs, such that at least a portion of said hemispherical lenses is directly coupled to the first surface of said submount panel, said hemispherical lenses comprising a protective layer on and covering the first surface of said submount panel between said hemispherical lens and an edge of said submount panel;
forming sets of surface mount contacts on the surface of said submount panel opposite said sets of attach pads and contact pads, each of said sets of said surface mount contacts corresponding to a respective one of said sets of attach pads and contact pads; and
singulating said submount panel into a plurality of LED packages, wherein each of said plurality of said singulated LED packages comprises at least one of said attach pads and at least one of said contact pads that in combination cover at least 75% of said first surface of the portion of said submount panel in said singulated LED package.