US 10,892,250 B2
Stacked package structure with encapsulation and redistribution layer and fabricating method thereof
Ming-Chih Chen, Hukou Township, Hsinchu County (TW); Hung-Hsin Hsu, Hukou Township, Hsinchu County (TW); Yuan-Fu Lan, Hukou Township, Hsinchu County (TW); and Hsien-Wen Hsu, Hukou Township, Hsinchu County (TW)
Assigned to Powertech Technology Inc., Hukou Township (TW)
Filed by Powertech Technology Inc., Hukou Township, Hsinchu County (TW)
Filed on Dec. 21, 2018, as Appl. No. 16/229,562.
Prior Publication US 2020/0203313 A1, Jun. 25, 2020
Int. Cl. H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/565 (2013.01); H01L 23/3157 (2013.01); H01L 23/3736 (2013.01); H01L 23/552 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 2224/02371 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A stacked package structure, comprising:
a metal casing having a lateral portion and a plurality of longitudinal portions extending from an inner surface of the lateral portion;
a stacked chipset having:
an active surface having a plurality of metal pads; and
a rear surface opposite to the active surface and adhered to the inner surface of the lateral portion of the metal casing;
an encapsulation encapsulating the stacked chipset and all outsides of the longitudinal portions of the metal casing, wherein a plurality of surfaces of the plurality of metal pads, each surface of a plurality free ends of the longitudinal portions and an outer surface of the encapsulation are coplanar to constitute a coplanar surface; and
a redistribution layer directly formed on the coplanar surface constituted by the surfaces of the plurality of metal pads, each surface of the free ends of the longitudinal portions and the outer surface of the encapsulation, wherein the redistribution layer electrically connecting to the plurality of metal pads of the stacked chipset.