US 10,892,230 B2
Magnetic shielding material with insulator-coated ferromagnetic particles
Tsung-Hsing Lu, Jhubei (TW); Pei-Haw Tsao, Tai-chung (TW); and Li-Huan Chu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 7, 2019, as Appl. No. 16/405,642.
Claims priority of provisional application 62/711,997, filed on Jul. 30, 2018.
Prior Publication US 2020/0035615 A1, Jan. 30, 2020
Int. Cl. H01L 23/552 (2006.01); H01L 23/495 (2006.01); H05K 9/00 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/4952 (2013.01); H05K 9/0086 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a semiconductor die;
a magnetic shield, including:
a mixture covering a first portion of the semiconductor die and having:
a plurality of first ferromagnetic particles;
an insulating coating encapsulating each of the plurality of first ferromagnetic particles; and
a matrix containing the first ferromagnetic particles; and
a magnetic epoxy covering a second portion of the semiconductor die and having a plurality of second ferromagnetic particles in electrical contact with each other.