US 10,892,213 B2
Wiring structure and method for manufacturing the same
Wen Hung Huang, Kaohsiung (TW); Li-Yu Hsieh, Kaohsiung (TW); and Yan Wen Chung, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 28, 2018, as Appl. No. 16/236,207.
Prior Publication US 2020/0211945 A1, Jul. 2, 2020
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01); H05K 3/40 (2006.01); H05K 3/36 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49822 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 22/14 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/544 (2013.01); H05K 3/36 (2013.01); H05K 3/4038 (2013.01); H01L 24/16 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/16227 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A wiring structure, comprising:
an upper conductive structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer;
a lower conductive structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer;
an adhesion layer interposed between the upper conductive structure and the lower conductive structure to bond the upper conductive structure and the lower conductive structure together; and
at least one via extending through at least a portion of the upper conductive structure and the adhesion layer, and electrically connected to the circuit layer of the lower conductive structure,
wherein a line width/line space (L/S) of the circuit layer of the lower conductive structure is greater than a line width/line space (L/S) of the circuit layer of the upper conductive structure, wherein each of the at least one dielectric layer of the upper conductive structure defines a through hole having an inner surface, the adhesion layer defines a through hole having an inner surface, and the inner surface of the through hole of the adhesion layer and the inner surfaces of the through holes of the at least one dielectric layer are coplanar with each other, and a material of the adhesion layer is transparent.