US 10,892,208 B2
Heat dissipation apparatus and method for power semiconductor devices
Hung-Li Chang, Chino Hills, CA (US); Lon C. Cooper, Azusa, CA (US); and David L. Bogdanchik, Pasadena, CA (US)
Assigned to BEIJING E. MOTOR ADVANCE CO. LTD., Beijing (CN)
Filed by Hung-Li Chang, Chino Hills, CA (US); Lon C. Cooper, Azusa, CA (US); and David L. Bogdanchik, Pasadena, CA (US)
Filed on Oct. 19, 2017, as Appl. No. 15/787,711.
Prior Publication US 2019/0139862 A1, May 9, 2019
Int. Cl. H01L 23/473 (2006.01); H01L 23/367 (2006.01); H01L 25/11 (2006.01); H01L 23/40 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/4093 (2013.01); H01L 25/115 (2013.01); H01L 25/112 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An improved power semiconductor heat dissipation apparatus, said apparatus comprising:
a liquid heat exchange manifold featuring:
an influent through which coolant fluid may flows into said manifold;
an effluent through which coolant fluid may flow out of said manifold;
a heat exchange surface positioned within said manifold between the influent and effluent such that the coolant fluid must flow past said heat exchange surface to flow from said influent to said effluent;
a first plenum defined by the space within said manifold between the influent and the heat exchange surface;
a second plenum defined by the space within said manifold between the heat exchange surface and the effluent;
at least one power semiconductor mounted externally to said manifold in thermal communication with said heat exchange surface; and
wherein said influent provides cooling fluid ingress to said first plenum and said effluent provides cooling fluid egress from said second plenum and said heat exchange surface extends between said first plenum and said second plenum such that cooling liquid must flow past said heat exchange surface to flow from said first plenum to said second plenum;
at least one flow balancer located inside and along the length of either the first or second plenum specifically shaped to manipulate the hydrodynamic pressure of the cooling fluid along the length of said heat exchange surface bordering said first plenum or second plenum to optimize coolant fluid flow distribution from the first plenum to the second plenum past said heat exchange surface.