US 10,892,199 B2
Semiconductor package structure, product and method for manufacturing the same
Yu-Ming Chen, Kaohsiung (TW); Yu-Sung Lin, Kaohsiung (TW); and Tai-Hung Kuo, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Apr. 1, 2019, as Appl. No. 16/372,107.
Prior Publication US 2020/0312730 A1, Oct. 1, 2020
Int. Cl. H01L 23/04 (2006.01); H01L 23/544 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/04 (2013.01) [H01L 21/4803 (2013.01); H01L 23/544 (2013.01); H01L 2223/54406 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package structure, comprising:
a substrate;
a semiconductor sensor disposed on the substrate;
a lid covering the semiconductor sensor and defining a through hole; and
an air-permeable film covering the through hole of the lid and having a first surface, wherein the first surface is hydrophilic.