US 10,892,180 B2
Lift pin assembly
Bonnie T. Chia, Sunnyvale, CA (US); Jallepally Ravi, San Ramon, CA (US); Manjunatha Koppa, Bangalore (IN); Vinod Konda Purathe, Bangalore (IN); Cheng-Hsiung Matthew Tsai, Cupertino, CA (US); and Aravind Miyar Kamath, Santa Clara, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Aug. 2, 2014, as Appl. No. 14/450,241.
Claims priority of provisional application 62/006,846, filed on Jun. 2, 2014.
Prior Publication US 2015/0348823 A1, Dec. 3, 2015
Int. Cl. H01L 21/687 (2006.01); C23C 16/46 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); C30B 25/12 (2006.01)
CPC H01L 21/68742 (2013.01) [H01L 21/67115 (2013.01); H01L 21/6831 (2013.01); C23C 16/46 (2013.01); C30B 25/12 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A system to lift an apparatus off of a substrate support, the system comprising:
the substrate support;
a platform independently movable with respect to the substrate support;
a shutter disk that is rotatable and independently movable from a lift pin assembly, the substrate support, and the platform, wherein the shutter disk is configured to protect the substrate support from damage during a process; and
the lift pin assembly including a sheath and a pin extending through the sheath, extending from the platform and comprising a first material providing a first upward support surface configured to support a substrate and a second material providing a second upward support surface configured to support the shutter disk, wherein the first material is different than the second material, wherein the first material is an electrically conductive polymer, wherein the second material is metallic, wherein the pin is formed of the first material and the sheath is formed of the second material and is configured to extend at least to an uppermost surface of the substrate support, wherein the sheath is directly mounted to a top surface of the platform, wherein the second upward support surface is disposed radially outward of the first upward support surface, wherein the first upward support surface is an upper surface of the pin and the second upward support surface is an upper surface of the sheath, and wherein the first upward support surface is above the second upward support surface.