US 10,892,170 B2
Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
Evan G. Colgan, Montvale, NJ (US); Yi Pan, The Woodlands, TX (US); Hilton T. Toy, Hopewell Junction, NY (US); and Jeffrey A. Zitz, Poughkeepsie, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jun. 1, 2018, as Appl. No. 15/996,030.
Application 15/996,030 is a continuation of application No. 14/732,119, filed on Jun. 5, 2015, granted, now 10,090,173.
Prior Publication US 2018/0277396 A1, Sep. 27, 2018
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/52 (2006.01); H05K 3/30 (2006.01); H01L 23/367 (2006.01); H01L 23/04 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 23/498 (2006.01); H01L 23/16 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01)
CPC H01L 21/52 (2013.01) [H01L 23/04 (2013.01); H01L 23/16 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 23/49838 (2013.01); H05K 3/303 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2023/4037 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15312 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/16793 (2013.01); H01L 2924/171 (2013.01); H01L 2924/176 (2013.01); H01L 2924/1715 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/2018 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method comprising:
attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip, a base portion, a first pair of opposing sidewalls, and a second pair of opposing sidewalls;
electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening;
thermally contacting a first directional heat spreader to the semiconductor chip, the first directional heat spreader arranged to transfer heat from the semiconductor chip in a first opposing bivector direction towards the first pair of opposing sidewalls; and
thermally contacting a second directional heat spreader to the first directional heat spreader, the second directional heat spreader arranged to transfer heat from the first directional heat spreader in a second opposing bivector direction towards the second pair of opposing sidewalls.