US 10,892,086 B2
Coil electronic component
Kwang Il Park, Suwon-si (KR); Young Sun Kim, Suwon-si (KR); and HyeYeon Cha, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jul. 3, 2018, as Appl. No. 16/26,351.
Claims priority of application No. 10-2017-0124288 (KR), filed on Sep. 26, 2017; and application No. 10-2017-0134804 (KR), filed on Oct. 17, 2017.
Prior Publication US 2019/0096564 A1, Mar. 28, 2019
Int. Cl. H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 41/042 (2013.01); H01F 2017/002 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A coil electronic component, comprising:
a body having disposed therein a support member with a through-hole, upper and lower coils on the support member, and a via connecting the upper and lower coils to each other; and
external electrodes on external surfaces of the body,
wherein the via is on at least a portion of a boundary surface of the through-hole,
the via has a multilayer structure with a plurality of stacked conductive pattern layers including at least one conductive pattern layer that is free of contact with the support member and body, and
two or more conductive pattern layers of the plurality of stacked conductive pattern layers extend through the through-hole and have thicknesses different from each other.