US 10,892,085 B2
Circuit board assemblies having magnetic components
Kwong Kei Chin, Fremont, CA (US)
Assigned to Astec International Limited, Kowloon (HK)
Filed by Astec International Limited, Kowloon (HK)
Filed on Dec. 5, 2017, as Appl. No. 15/832,415.
Claims priority of provisional application 62/432,125, filed on Dec. 9, 2016.
Prior Publication US 2018/0166203 A1, Jun. 14, 2018
Int. Cl. H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 41/02 (2006.01); H01F 27/24 (2006.01); H01F 27/29 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/24 (2013.01); H01F 27/29 (2013.01); H01F 41/02 (2013.01); H05K 1/0256 (2013.01); H01F 2027/2819 (2013.01); H05K 1/181 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/1003 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A circuit board assembly comprising:
a circuit board including an inner layer;
a magnetic component coupled to the circuit board, the magnetic component including a primary winding and a secondary winding;
a winding interconnect terminal electrically coupled to one of the primary winding and the secondary winding of the magnetic component, the winding interconnect terminal disposed on the circuit board remote from the magnetic component, and the circuit board defining an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the other of the primary winding and the secondary winding of the magnetic component;
at least one conductive trace disposed in the inner layer of the circuit board and coupled between the winding interconnect terminal and the primary winding of the magnetic component; and
wherein the at least one conductive trace extends from the magnetic component on a first side of the magnetic component and the winding interconnect terminal is located on a second side of the magnetic component opposite the first side.